BAV70TT1G, NSVBAV70TT1G, NSVBAV70TT3G
http://onsemi.com
5
PACKAGE DIMENSIONS
SC?75/SOT?416
CASE 463?01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
0.20 (0.008)
M
D
?E?
?D?
b
3 PL
e
0.20 (0.008)
E
C
L
A
A1
3
2
1
HE
DIM MIN NOM MAX
MILLIMETERS
A
0.70 0.80 0.90
A1
0.00 0.05 0.10
b
C
0.10 0.15 0.25
D
1.55 1.60 1.65
E
e
1.00 BSC
0.027 0.031 0.035
0.000 0.002 0.004
0.004 0.006 0.010
0.059 0.063 0.067
0.04 BSC
MIN NOM MAX
INCHES
0.15 0.20 0.30
0.006 0.008 0.012
HE
L
0.10 0.15 0.20
1.50 1.60 1.70
0.004 0.006 0.008
0.061 0.063 0.065
0.70 0.80 0.90
0.027 0.031 0.035
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm
inches
0.356
0.014
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.803
0.071
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
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